Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices
نویسندگان
چکیده
منابع مشابه
The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation
Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@...
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ژورنال
عنوان ژورنال: Polymers for Advanced Technologies
سال: 2017
ISSN: 1042-7147
DOI: 10.1002/pat.4038